Welcome to the world of Besi
BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.
Publications
Hybrid Bonding Presentation
PDF file - 3.57 MB
Investor Presentation November 2021
PDF file - 4.65 MB
ESG report 2020
PDF file - 5.99 MB